Adhesives Technology for Electronic Applications. Materials, by James J. Licari

By James J. Licari

  • "I suggest this publication with no reservation to every person in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley


, Pages vii-viii

, Pages ix-x
1 - Introduction

, Pages 1-37
2 - features and conception of Adhesives

, Pages 39-94
3 - Chemistry, formula, and houses of Adhesives

, Pages 95-168
4 - Adhesive Bonding Processes

, Pages 169-260
5 - Applications

, Pages 261-346
6 - Reliability

, Pages 347-391
7 - attempt and Inspection Methods

, Pages 393-430

, Pages 431-439

, Pages 441-457

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Additional resources for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability

Sample text

However, anaerobic adhesives found wide use in locking threaded fasteners, thread sealing, and in impregnating porous surfaces. The next generation of adhesives (1970s) saw further improvements in purification of epoxy adhesives in which the chloride, potassium, sodium, and other ions were reduced to levels below 20 ppm. Outgassing was also reduced by changes in the hardeners used to cure the epoxies and by optimizing the cure schedules. The first specification for the qualification of adhesives was issued during this period by NASA’s Marshall Space Flight Center in 1978.

Shape factors for underfill fillets. 2. 9416 Source: Electronics Engineer (1998). Metallurgical bonding. Metallurgical bonding and interconnections dominated the early electronics field. Tin-lead solder has been used for decades and is still in wide use today both for mechanical attachment and electrical connections. Examples include surface mounting of components on PWBs, soldering the leads of cable assemblies, edge connectors and transformers to PWBs, and attaching leadframes to substrates and packages.

7% from 2003 through 2008. The total dollar value of adhesives is predicted to increase from $259 million in 2003 to $650 million in 2013. Adhesives for electronics comprise approximately 10% of the total market for polymeric materials used in electronics. 22. � Dietz, R. , New Die Attach Material For Hermetic Packaging, Proc. Mfg. , Handbook of Epoxy Resins, Ch. � Galloway, D. , Reliability of Novel Die Attach Adhesive for Snap Curing, Proc. , Novel Snap Cure Die Attach for In-Line Processing, Solid State Technol.

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